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1. product profile 1.1 general description pnp/pnp double resistor-equipped trans istors (ret) in surface-mounted device (smd) plastic packages. 1.2 features and benefits 1.3 applications 1.4 quick reference data pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? rev. 3 ? 17 november 2011 product data sheet table 1. product overview type number package npn/pnp complement npn/npn complement package configuration nxp jeita pemb2 sot666 - pemd12 pemh2 ultra small and flat lead PUMB2 sot363 sc-88 pumd12 pumh2 very small ? 100 ma output current capability ? reduces component count ? built-in bias resistors ? reduces pick and place costs ? simplifies circuit design ? aec-q101 qualified ? low current per ipheral driver ? control of ic inputs ? replaces general-purpose trans istors in digital applications table 2. quick reference data symbol parameter conditions min typ max unit per transistor v ceo collector-emitter voltage open base - - ? 50 v i o output current - - ? 100 ma r1 bias resistor 1 (input) 33 47 61 k ? r2/r1 bias resistor ratio 0.8 1 1.2
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 2 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 2. pinning information 3. ordering information 4. marking [1] * = placeholder for manufacturing site code table 3. pinning pin description simplified outline graphic symbol 1 gnd (emitter) tr1 2 input (base) tr1 3 output (collector) tr2 4 gnd (emitter) tr2 5 input (base) tr2 6 output (collector) tr1 001aab555 6 4 5 1 3 2 006aaa212 5 r1 r2 r2 tr1 tr2 r1 64 2 13 table 4. ordering information type number package name description version pemb2 - plastic surface-mounted package; 6 leads sot666 PUMB2 sc-88 plastic surface-mounted package; 6 leads sot363 table 5. marking codes type number marking code [1] pemb2 b2 PUMB2 b*2
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 3 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 5. limiting values [1] device mounted on an fr4 printed-circuit board (pcb), single-sided copper, tin-plated and standard footprint. [2] reflow soldering is the only recommended soldering method. table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min max unit per transistor v cbo collector-base voltage open emitter - ? 50 v v ceo collector-emitter voltage open base - ? 50 v v ebo emitter-base voltage open collector - ? 10 v v i input voltage positive - +10 v negative - ? 40 v i o output current - ? 100 ma i cm peak collector current single pulse; t p ? 1ms - ? 100 ma p tot total power dissipation t amb ? 25 ?c pemb2 (sot666) [1] [2] -200mw PUMB2 (sot363) [1] -200mw per device p tot total power dissipation t amb ? 25 ?c pemb2 (sot666) [1] [2] -300mw PUMB2 (sot363) [1] -300mw t j junction temperature - 150 ?c t amb ambient temperature ? 65 +150 ?c t stg storage temperature ? 65 +150 ?c
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 4 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 6. thermal characteristics [1] device mounted on an fr4 pcb, single-si ded copper, tin-plated and standard footprint. [2] reflow soldering is the only recommended soldering method. fr4 pcb, standard footprint fig 1. per device: power derating curve for sot363 (sc-88) and sot666 t amb (c) -75 175 125 25 75 -25 006aac749 200 100 300 400 p tot (mw) 0 table 7. thermal characteristics symbol parameter conditions min typ max unit per transistor r th(j-a) thermal resistance from junction to ambient in free air pemb2 (sot666) [1] [2] - - 625 k/w PUMB2 (sot363) [1] - - 625 k/w per device r th(j-a) thermal resistance from junction to ambient in free air pemb2 (sot666) [1] [2] - - 417 k/w PUMB2 (sot363) [1] - - 417 k/w
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 5 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? fr4 pcb, standard footprint fig 2. per transistor: transient thermal impedance from junction to ambient as a function of pu lse duration for pemb2 (sot666); typical values fr4 pcb, standard footprint fig 3. per transistor: transient thermal impedance from junction to ambient as a function of pu lse duration for PUMB2 (sot363); typical values 006aac751 10 -5 10 10 -2 10 -4 10 2 10 -1 t p (s) 10 -3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0 006aac750 10 -5 10 10 -2 10 -4 10 2 10 -1 t p (s) 10 -3 10 3 1 10 2 10 10 3 z th(j-a) (k/w) 1 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.01 0
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 6 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 7. characteristics [1] characteristics of built-in transistor table 8. characteristics t amb =25 ? c unless otherwise specified. symbol parameter conditions min typ max unit per transistor i cbo collector-base cut-off current v cb = ? 50 v; i e =0a - - ? 100 na i ceo collector-emitter cut-off current v ce = ? 30 v; i b =0a - - ? 1 ? a v ce = ? 30 v; i b =0a; t j =150 ?c -- ? 5 ? a i ebo emitter-base cut-off current v eb = ? 5v; i c =0a - - ? 90 ? a h fe dc current gain v ce = ? 5v; i c = ? 5ma 80 - - v cesat collector-emitter saturation voltage i c = ? 10 ma; i b = ? 0.5 ma - - ? 150 mv v i(off) off-state input voltage v ce = ? 5v; i c = ? 100 ? a- ? 1.2 ? 0.8 v v i(on) on-state input voltage v ce = ? 0.3 v; i c = ? 2ma ? 3 ? 1.6 - v r1 bias resistor 1 (input) 33 47 61 k ? r2/r1 bias resistor ratio 0.8 1 1.2 c c collector capacitance v cb = ? 10 v; i e =i e =0a; f=1mhz --3pf f t transition frequency v ce = ? 5v; i c = ? 10 ma; f=100mhz [1] - 180 - mhz
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 7 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? v ce = ?5v (1) t amb = 100 ? c (2) t amb =25 ? c (3) t amb = ?40 ? c i c /i b =20 (1) t amb = 100 ? c (2) t amb =25 ? c (3) t amb = ?40 ? c fig 4. dc current gain as a function of collector current; typical values fig 5. collector-emitter saturation voltage as a function of collector current; typical values v ce = ? 0.3 v (1) t amb = ?40 ? c (2) t amb =25 ? c (3) t amb = 100 ? c v ce = ?5v (1) t amb = ?40 ? c (2) t amb =25 ? c (3) t amb = 100 ? c fig 6. on-state input voltage as a function of collector current; typical values fig 7. off-state input volt age as a function of collector current; typical values i c (ma) -10 -1 -10 2 -10 -1 006aac758 10 2 10 10 3 h fe 1 (1) (2) (3) 006aac759 i c (ma) -10 -1 -10 2 -10 -1 -10 -1 -1 v cesat (v) -10 -2 (1) (2) (3) 006aac760 i c (ma) -10 -1 -10 2 -10 -1 -1 -10 v i(on) (v) -10 -1 (1) (2) (3) i c (ma) -10 -1 -10 -1 006aac761 -1 -10 v i(off) (v) -10 -1 (1) (2) (3)
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 8 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 8. test information 8.1 quality information this product has been qualified in accordance with the automotive electronics council (aec) standard q101 - stress test qualificat ion for discrete semiconductors , and is suitable for use in automotive applications. 9. package outline f=1mhz; t amb =25 ? cv ce = ? 5v; t amb =25 ? c fig 8. collector capacitance as a function of collector-base voltage; typical values of built-in transistor fig 9. transition frequency as a function of collector current; typical values of built-in transistor v cb (v) 0 -50 -40 -20 -30 -10 006aac762 3 6 9 c c (pf) 0 006aac763 i c (ma) -10 -1 -10 2 -10 -1 10 2 10 3 f t (mhz) 10 fig 10. package outline pemb2 (sot666) fig 11. package outline PUMB2 (sot363) dimensions in mm 04-11-08 1.7 1.5 1.7 1.5 1.3 1.1 1 0.18 0.08 0.27 0.17 0.5 pin 1 index 123 456 0.6 0.5 0.3 0.1 06-03-16 dimensions in mm 0.25 0.10 0.3 0.2 pin 1 index 1.3 0.65 2.2 2.0 1.35 1.15 2.2 1.8 1.1 0.8 0.45 0.15 13 2 4 65
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 9 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 10. packing information [1] for further information and the avai lability of packing methods, see section 14 . [2] t1: normal taping [3] t2: reverse taping 11. soldering table 9. packing methods the indicated -xxx are the last thre e digits of the 12nc ordering code. [1] type number package description packing quantity 3000 4000 8000 10000 pemb2 sot666 2 mm pitch, 8 mm tape and reel - - -315 - 4 mm pitch, 8 mm tape and reel - -115 - - PUMB2 sot363 4 mm pitch, 8 mm tape and reel; t1 [2] -115 - - -135 4 mm pitch, 8 mm tape and reel; t2 [3] -125 - - -165 reflow soldering is the only recommended soldering method. fig 12. reflow soldering footprint pemb2 (sot666) solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6) 0.55 (2) 0.25 (2) 0.6 (2) 0.65 (2) 0.3 (2) 0.325 (4) 0.45 (4) 0.5 (4) 0.375 (4) 1.72 1.7 1.075 0.538 dimensions in mm
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 10 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? fig 13. reflow soldering footprint PUMB2 (sot363) fig 14. wave soldering footprint PUMB2 (sot363) solder lands solder resist occupied area solder paste sot363_fr 2.65 2.35 0.4 (2) 0.6 (2) 0.5 (4) 0.5 (4) 0.6 (4) 0.6 (4) 1.5 1.8 dimensions in mm sot363_fw solder lands solder resist occupied area preferred transport direction during soldering 5.3 1.3 1.3 1.5 0.3 1.5 4.5 2.45 2.5 dimensions in mm
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 11 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 12. revision history table 10. revision history document id release date data sheet status change notice supersedes pemb2_PUMB2 v.3 20111117 product data sheet - pemb2_PUMB2 v.2 modifications: ? the format of this document has been re designed to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? section 1 ? product profile ? : updated ? section 4 ? marking ? : updated ? figure 1 to 9 : added ? section 5 ? limiting values ? : updated ? section 6 ? thermal characteristics ? : updated ? table 8 ? characteristics ? : v i(on) redefined to v i(on) on-state input voltage, v i(off) redefined to v i(off) off-state input voltage, i ceo updated, f t added ? section 8 ? test information ? : added ? section 9 ? package outline ? : superseded by minimized package outline drawing ? section 10 ? packing information ? : added ? section 11 ? soldering ? : added ? section 13 ? legal information ? : updated pemb2_PUMB2 v.2 20031015 product data sheet - PUMB2 v.1 pemb2 v.1 pemb2 v.1 20010914 product specification - - PUMB2 v.1 19910803 product specification - -
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 12 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? 13. legal information 13.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 13.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 13.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
pemb2_PUMB2 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2011. all rights reserved. product data sheet rev. 3 ? 17 november 2011 13 of 14 nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. 13.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 14. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors pemb2; PUMB2 pnp/pnp resistor-equipped transistors; r1 = 47 k ? , r2 = 47 k ? ? nxp b.v. 2011. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 17 november 2011 document identifier: pemb2_PUMB2 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 15. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 packing information . . . . . . . . . . . . . . . . . . . . . 9 11 soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 12 revision history . . . . . . . . . . . . . . . . . . . . . . . . 11 13 legal information. . . . . . . . . . . . . . . . . . . . . . . 12 13.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 12 13.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 13.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 contact information. . . . . . . . . . . . . . . . . . . . . 13 15 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

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